FCCSP-Pakketsubstraat
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Groen het Pakketsubstraat 0.3mm van PBGA/CSP-het Materiaal van Diktebt voor IC-Assemblage
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Hoog licht:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... Bekijk meer
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FCCSP-substraatvervaardiging ondersteunend China
Prijs: US 120-150 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Hoog licht:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... Bekijk meer
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FCCSP-Opbouwtypes ENEPIG van het pakketsubstraat 4L
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Hoog licht:0.2mm Antenna Circuit Board, Intelligent Handwriting Antenna Circuit Board, Large 0.2mm Antenna PCB
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Bekijk meer
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semiconductor FCCSP Package Substrate manufacture
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... Bekijk meer
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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Hoog licht:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Bekijk meer
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Hoog licht:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... Bekijk meer
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FCCSP-de productie van het pakketsubstraat het steunen
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Bekijk meer
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De productie van het het pakketsubstraat van Flip Chip CSP het steunen
Prijs: US 85-100 per square meter
MOQ: 1 square meter
Tijd om te bezorgen: 7-10 working days
Merk: Horexs
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... Bekijk meer
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