310*320mm Paneldomein Paneldimensionaliteit QFN Lage elektrische weerstand
Prijs: Negotiable
MOQ: Negotiable
Tijd om te bezorgen: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Bekijk meer
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310*320mm Panelgrootte Thin MOS Chip Silicon Lage stroomverbruik
Prijs: Negotiable
MOQ: 3000pcs
Tijd om te bezorgen: 1 month
Merk: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Bekijk meer
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Verpakkingsoppervlak van het paneel Gezicht naar beneden-EWLB Hoge warmteafvoer Hoge betrouwbaarheid
Prijs: Negotiable
MOQ: Negotiable
Tijd om te bezorgen: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Bekijk meer
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310*320 mm Fan-Out Panel Level Packaging (FOPLP) GaN-product
Prijs: Negotiable
MOQ: 3000pcs
Tijd om te bezorgen: 1 month
Merk: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Bekijk meer
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hoge beeldverhouding TGV Foundary Capabilities voor halfgeleiderverpakkingen
Prijs: Negotiable
MOQ: 10 panel
Tijd om te bezorgen: 1 month
Merk: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Bekijk meer
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Verpakking geschikt voor verschillende verpakkingssimulatie-experimenten
Prijs: Negotiable
MOQ: 3000pcs
Tijd om te bezorgen: 1 month
Merk: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Bekijk meer
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