Verpakkingssimulatie-experimenten
(1)
Verpakking geschikt voor verschillende verpakkingssimulatie-experimenten
Prijs: Negotiable
MOQ: 3000pcs
Tijd om te bezorgen: 1 month
Merk: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Bekijk meer
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